Invention Grant
- Patent Title: Assembly method of transfer mechanism and transfer chamber
- Patent Title (中): 传输机构和传送室的装配方法
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Application No.: US12847320Application Date: 2010-07-30
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Publication No.: US08499430B2Publication Date: 2013-08-06
- Inventor: Youhei Yamada , Yoshihiro Kai
- Applicant: Youhei Yamada , Yoshihiro Kai
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-178874 20090731
- Main IPC: B23P11/00
- IPC: B23P11/00 ; B23P19/00 ; B66C13/06 ; B66C19/00 ; B65G1/133

Abstract:
An assembly method is capable of assembling a transfer mechanism which transfers a target and includes a pick unit for holding the target, a slide unit for sliding the pick unit and a drive unit for driving the slide unit. The assembly method includes installing a lifting mechanism for lifting the units at a ceiling portion of a transfer chamber where the transfer mechanism is accommodated; and assembling the units loaded into the transfer chamber inside the transfer chamber by using the lifting mechanism.
Public/Granted literature
- US20110027058A1 ASSEMBLY METHOD OF TRANSFER MECHANISM AND TRANSFER CHAMBER Public/Granted day:2011-02-03
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