Invention Grant
- Patent Title: Printhead module for an inkjet printhead assembly
- Patent Title (中): 用于喷墨打印头组件的打印头模块
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Application No.: US13219698Application Date: 2011-08-28
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Publication No.: US08500249B2Publication Date: 2013-08-06
- Inventor: Kia Silverbrook , Tobin Allen King , Garry Raymond Jackson
- Applicant: Kia Silverbrook , Tobin Allen King , Garry Raymond Jackson
- Applicant Address: IE Dublin
- Assignee: Zamtec Ltd
- Current Assignee: Zamtec Ltd
- Current Assignee Address: IE Dublin
- Agency: Cooley LLP
- Main IPC: B41J1/14
- IPC: B41J1/14 ; B41J2/16

Abstract:
A printhead module is provided for an inkjet printhead assembly. The printhead module includes a support. An elongate carrier is mounted to the support. The carrier defines a plurality of transverse ribs and an ink channel located between the ribs. A subassembly includes a micro-electromechanical integrated circuit (IC) configured to eject ink. The subassembly is mounted to the carrier so that the support, carrier and subassembly define a plurality of sealed ink chambers which can feed ink to the IC via the ink channel.
Public/Granted literature
- US20110310180A1 PRINTHEAD MODULE FOR AN INKJET PRINTHEAD ASSEMBLY Public/Granted day:2011-12-22
Information query
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