Invention Grant
- Patent Title: Manufacturing method of liquid ejecting head, liquid ejecting head, and liquid ejecting apparatus
- Patent Title (中): 液体喷射头,液体喷射头和液体喷射装置的制造方法
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Application No.: US12712010Application Date: 2010-02-24
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Publication No.: US08500255B2Publication Date: 2013-08-06
- Inventor: Hiroshige Owaki , Hiroyuki Kobayashi , Kazuhide Nakamura
- Applicant: Hiroshige Owaki , Hiroyuki Kobayashi , Kazuhide Nakamura
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-041919 20090225
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A manufacturing method produces a liquid ejecting head including first and second flow path members having liquid flow paths that communicate with each other. An integrally-molded member is surrounds the second flow path member on the second flow path member side of the first flow path member to join the first and second flow path members together. A holding process defines a space portion for forming the integrally-molded member in a frame section. The frame section is brought into contact with a contact surface of a recessed portion in the face of the second flow path member opposite the first flow path member, with the first and second flow path members contacting each other such that the liquid flow paths communicate with each other. A molding process fills the space portion with resin, thereby molding the integrally-molded member, and joins the first and second flow path members together.
Public/Granted literature
- US20100214379A1 MANUFACTURING METHOD OF LIQUID EJECTING HEAD, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2010-08-26
Information query
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