Invention Grant
- Patent Title: Radiation curable resin composition and rapid three-dimensional imaging process using the same
- Patent Title (中): 辐射固化树脂组合物和使用其的快速三维成像方法
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Application No.: US13001655Application Date: 2010-03-12
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Publication No.: US08501033B2Publication Date: 2013-08-06
- Inventor: John Southwell , Brett A. Register , Satyendra Kumar Sarmah , Paulus Antonius Maria Steeman , Beert Jacobus Keestra , Marcus Matheus Driessen
- Applicant: John Southwell , Brett A. Register , Satyendra Kumar Sarmah , Paulus Antonius Maria Steeman , Beert Jacobus Keestra , Marcus Matheus Driessen
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye PC
- International Application: PCT/US2010/000760 WO 20100312
- International Announcement: WO2010/104603 WO 20100916
- Main IPC: C09K3/00
- IPC: C09K3/00 ; C08F20/18 ; C08F20/10 ; C08F32/04

Abstract:
The invention relates to a liquid radiation curable resin capable of curing into a solid upon irradiation comprising: (A) from about 0 to about 12 wt % of a cycloaliphatic epoxide having a linking ester group; (B) from about 30 to about 65 wt % of one or more epoxy functional components other than A; (C) from about 10 to about 30 wt % of one or more oxetanes; (D) from, about 1 to about 10 wt % of one or more polyols; (E) from about 2 to about 20 wt % of one or more radically curable (meth)acrylate components; (F) from about 2 to about 12 wt % of one or more impact modifiers; (G) from about 0.1 to about 8 wt % of one or more free radical photoinitiators; and (H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators; wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 600 cps to about 1300 cps.
Public/Granted literature
- US20110104500A1 RADIATION CURABLE RESIN COMPOSITION AND RAPID THREE-DIMENSIONAL IMAGING PROCESS USING THE SAME Public/Granted day:2011-05-05
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