Invention Grant
- Patent Title: Upper layer-forming composition and resist patterning method
- Patent Title (中): 上层形成组合物和抗蚀剂图案化方法
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Application No.: US13069439Application Date: 2011-03-23
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Publication No.: US08501389B2Publication Date: 2013-08-06
- Inventor: Kazunori Kusabiraki , Takahiro Hayama , Norihiko Sugie , Motoyuki Shima , Kiyoshi Tanaka
- Applicant: Kazunori Kusabiraki , Takahiro Hayama , Norihiko Sugie , Motoyuki Shima , Kiyoshi Tanaka
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2010-066335 20100323
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/11
Abstract:
An upper-layer film-forming composition includes (A) a resin that is soluble in an alkaline aqueous solution, and includes a fluorine atom, and (B) a solvent component that includes (B1) a solvent having a boiling point at 101.3 kPa of 150° C. or more and a static surface tension of 23.0 mN/m or less, the upper-layer film-forming composition being used to form an upper-layer film on a photoresist film.
Public/Granted literature
- US20110262859A1 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD Public/Granted day:2011-10-27
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