Invention Grant
- Patent Title: Integrated circuit package system with dual side connection and method for manufacturing thereof
- Patent Title (中): 具有双面连接的集成电路封装系统及其制造方法
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Application No.: US13017170Application Date: 2011-01-31
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Publication No.: US08501535B2Publication Date: 2013-08-06
- Inventor: Sungmin Song , SeungYun Ahn , JoHyun Bae
- Applicant: Sungmin Song , SeungYun Ahn , JoHyun Bae
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method for manufacturing an integrated circuit package system includes: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.
Public/Granted literature
- US20110115098A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2011-05-19
Information query
IPC分类:
