Invention Grant
US08501536B2 Integrating and aligning laser chips on sliders for HAMR applications 有权
将激光芯片集成和对准用于HAMR应用的滑块

Integrating and aligning laser chips on sliders for HAMR applications
Abstract:
A method of producing a slider wafer populated with electromagnetic components optically aligned with photonic elements for HAMR applications. Laser chips are transferred from a laser substrate wafer to the slider wafer by a massively parallel printing transfer process. After wafer bonding the laser chips to the slider wafer, the shape and optical alignment of the photonic elements are precisely aligned en masse by lithographic processing.
Information query
Patent Agency Ranking
0/0