Invention Grant
US08501561B2 Method for producing a semiconductor component arrangement comprising a trench transistor
有权
一种用于制造包括沟槽晶体管的半导体部件装置的方法
- Patent Title: Method for producing a semiconductor component arrangement comprising a trench transistor
- Patent Title (中): 一种用于制造包括沟槽晶体管的半导体部件装置的方法
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Application No.: US12987847Application Date: 2011-01-10
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Publication No.: US08501561B2Publication Date: 2013-08-06
- Inventor: Markus Zundel , Franz Hirler , Norbert Krischke
- Applicant: Markus Zundel , Franz Hirler , Norbert Krischke
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Maginot, Moore & Beck
- Priority: DE102006010510 20060307
- Main IPC: H01L29/768
- IPC: H01L29/768

Abstract:
Disclosed is a semiconductor component arrangement and a method for producing a semiconductor component arrangement. The method comprises producing a trench transistor structure with at least one trench disposed in the semiconductor body and with at least an gate electrode disposed in the at least one trench. An electrode structure is disposed in at least one further trench and comprises at least one electrode. The at least one trench of the transistor structure and the at least one further trench are produced by common process steps. Furthermore, the at least one electrode of the electrode structure and the gate electrode are produced by common process steps.
Public/Granted literature
- US20110165755A1 Semiconductor Component Arrangement Comprising a Trench Transistor Public/Granted day:2011-07-07
Information query
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