Invention Grant
- Patent Title: Manufacturing method of semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US12247439Application Date: 2008-10-08
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Publication No.: US08501585B2Publication Date: 2013-08-06
- Inventor: Shunpei Yamazaki , Takeshi Shichi , Naoki Suzuki
- Applicant: Shunpei Yamazaki , Takeshi Shichi , Naoki Suzuki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2007-264424 20071010
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46

Abstract:
To realize high performance and low power consumption of a semiconductor device by controlling electric characteristics of a transistor in accordance with a required function. Further, to manufacture such a semiconductor device with high yield and high productivity without complicating a manufacturing process. An impurity element imparting one conductivity type is added to a first semiconductor wafer in order to control the threshold voltage of a transistor included in the semiconductor device, before separating a single crystal semiconductor layer used as a channel formation region of the transistor from the first semiconductor wafer and transferring the single crystal semiconductor layer to a second semiconductor wafer.
Public/Granted literature
- US20090098690A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2009-04-16
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