Invention Grant
- Patent Title: Methods and apparatus for conformal doping
- Patent Title (中): 保形掺杂的方法和装置
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Application No.: US13188824Application Date: 2011-07-22
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Publication No.: US08501605B2Publication Date: 2013-08-06
- Inventor: Kartik Santhanam , Martin A. Hilkene , Manoj Vellaikal , Mark R. Lee , Matthew D. Scotney-Castle , Peter I. Porshnev
- Applicant: Kartik Santhanam , Martin A. Hilkene , Manoj Vellaikal , Mark R. Lee , Matthew D. Scotney-Castle , Peter I. Porshnev
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/22
- IPC: H01L21/22 ; H01L21/38
Abstract:
Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of doping a substrate may include forming a dopant region on a substrate by implanting one or more dopant elements into the dopant region of the substrate using a plasma doping process; forming a cap layer atop the dopant region; annealing the dopant region after forming the cap layer; and removing the cap layer after annealing the dopant region.
Public/Granted literature
- US20120238074A1 METHODS AND APPARATUS FOR CONFORMAL DOPING Public/Granted day:2012-09-20
Information query
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