Invention Grant
- Patent Title: Flip chip structure and method of manufacture
- Patent Title (中): 倒装芯片结构及制造方法
-
Application No.: US11858289Application Date: 2007-09-20
-
Publication No.: US08501612B2Publication Date: 2013-08-06
- Inventor: John D. Moran , Blanca Kruse , Amilcar B. Gamez Sanchez
- Applicant: John D. Moran , Blanca Kruse , Amilcar B. Gamez Sanchez
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Kevin B. Jackson
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A flip chip structure includes glass stand-offs formed overlying a substrate surface. A conductive layer is formed overlying the glass stand-offs and configured for attaching to a next level of assembly. In one embodiment, photo glass processing is used to form the glass stand-offs.
Public/Granted literature
- US20090079093A1 FLIP CHIP STRUCTURE AND METHOD OF MANUFACTURE Public/Granted day:2009-03-26
Information query
IPC分类:
