Wiring board bases 2 to 4 are provided with: insulating substrates 1a to 4a having conductive layers 1b to 4b provided on one surfaces thereof, respectively; through-holes 2e to 4e which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias 2d to 4d connected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portion 2g is formed.