Invention Grant
US08502121B2 Radiofrequency welding apparatus 有权
射频焊接设备

  • Patent Title: Radiofrequency welding apparatus
  • Patent Title (中): 射频焊接设备
  • Application No.: US12486533
    Application Date: 2009-06-17
  • Publication No.: US08502121B2
    Publication Date: 2013-08-06
  • Inventor: Mark A. Vess
  • Applicant: Mark A. Vess
  • Applicant Address: US MA Mansfield
  • Assignee: Covidien LP
  • Current Assignee: Covidien LP
  • Current Assignee Address: US MA Mansfield
  • Agent John Paul Mello, Esq.
  • Main IPC: B23K13/01
  • IPC: B23K13/01
Radiofrequency welding apparatus
Abstract:
Apparatus and methods for radiofrequency (RF) welding are disclosed. RF power delivered to a welding platen of the apparatus is capacitively split into first and second RF power components of different magnitudes. The power components are simultaneously delivered to respective first and second die members to conduct an RF welding operation.
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