Invention Grant
- Patent Title: Optical proximity sensor package with lead frame
- Patent Title (中): 光学接近传感器封装带引线框架
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Application No.: US12697276Application Date: 2010-01-31
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Publication No.: US08502151B2Publication Date: 2013-08-06
- Inventor: Yufeng Yao , Junhua He , Wee Sin Tan
- Applicant: Yufeng Yao , Junhua He , Wee Sin Tan
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: G01J5/20
- IPC: G01J5/20 ; G01J5/02 ; H01L27/146 ; H01L31/0232 ; H01L31/0203 ; H01L21/00

Abstract:
Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
Public/Granted literature
- US20110186736A1 Optical Proximity Sensor Package with Lead Frame Public/Granted day:2011-08-04
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