Invention Grant
- Patent Title: Layer assembly
- Patent Title (中): 层组装
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Application No.: US13711322Application Date: 2012-12-11
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Publication No.: US08502197B2Publication Date: 2013-08-06
- Inventor: André Strittmatter , Andrei Schliwa , Tim David Germann , Udo W. Pohl , Vladimir Gaysler , Jan-Hindrik Schulze
- Applicant: Technische Universität Berlin
- Applicant Address: DE Berlin
- Assignee: Technische Universitat Berlin
- Current Assignee: Technische Universitat Berlin
- Current Assignee Address: DE Berlin
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/00

Abstract:
A device including a locally modified buried first layer. A second layer is arranged on top of the first layer. The first layer includes at least one modified section and at least one unmodified section. The modified material of the locally modified buried first layer changes or induces mechanical strain in a portion of the second layer which is arranged above the at least one modified section. At least one nanostructure is placed on top of the second layer in an area, which is located above the at least one unmodified section of the first layer or adjacent thereto, said at least one nanostructure being formed by a strain-sensitive third material deposited on the locally strained second layer.
Public/Granted literature
- US20130099200A1 LAYER ASSEMBLY Public/Granted day:2013-04-25
Information query
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