Invention Grant
US08502227B2 Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device
有权
有源矩阵基板,显示装置,有源矩阵基板的检查方法以及检查显示装置的方法
- Patent Title: Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device
- Patent Title (中): 有源矩阵基板,显示装置,有源矩阵基板的检查方法以及检查显示装置的方法
-
Application No.: US13055029Application Date: 2009-05-11
-
Publication No.: US08502227B2Publication Date: 2013-08-06
- Inventor: Masahiro Yoshida , Takehiko Kawamura , Katsuhiro Okada
- Applicant: Masahiro Yoshida , Takehiko Kawamura , Katsuhiro Okada
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Nixon & Vanderhye, P.C.
- Priority: JP2008-190148 20080723
- International Application: PCT/JP2009/058777 WO 20090511
- International Announcement: WO2010/010750 WO 20100128
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
An active matrix substrate (2) is provided with first connecting wirings (641, 643, 645, 647) connected to gate terminals (51) to which extraction wirings (611, 613, 615, 617) are connected, second connecting wirings (642, 644, 646) connected to gate terminals (51) to which extraction wirings (612, 614, 616) are connected, bundled wirings (651 to 654) each composed of a mutually adjacent first connecting wiring and second connecting wiring bunched together, a first inspection wiring (66) capable of inputting an inspection signal to bunched wirings (652, 654) that are not adjacent to each other among the bundled wirings, and a second inspection wiring (67) capable of inputting an inspection signal to bundled wirings (651, 653) that are not adjacent to each other and not connected to the first inspection wiring (66) among the bundled wirings.
Public/Granted literature
Information query
IPC分类: