Invention Grant
- Patent Title: Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device
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Application No.: US13688021Application Date: 2012-11-28
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Publication No.: US08502238B2Publication Date: 2013-08-06
- Inventor: Shigetoshi Ito , Takayuki Yuasa , Yoshihiro Ueta , Mototaka Taneya , Zenpei Tani , Kensaku Motoki
- Applicant: Shigetoshi Ito , Takayuki Yuasa , Yoshihiro Ueta , Mototaka Taneya , Zenpei Tani , Kensaku Motoki
- Applicant Address: JP Osaka-shi JP Osaka-shi
- Assignee: Sharp Kabushiki Kaisha,Sumitomo Electric Industries, Ltd.
- Current Assignee: Sharp Kabushiki Kaisha,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi JP Osaka-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2001-330068 20011029; JP2001-330181 20011029
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A nitride semiconductor laser device with a reduction in internal crystal defects and an alleviation in stress, and a semiconductor optical apparatus comprising this nitride semiconductor laser device. First, a growth suppressing film against GaN crystal growth is formed on the surface of an n-type GaN substrate equipped with alternate stripes of dislocation concentrated regions showing a high density of crystal defects and low-dislocation regions so as to coat the dislocation concentrate regions. Next, the n-type GaN substrate coated with the growth suppressing film is overlaid with a nitride semiconductor layer by the epitaxial growth of GaN crystals. Further, the growth suppressing film is removed to adjust the lateral distance between a laser waveguide region and the closest dislocation concentrated region to 40 μm or more.
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