Invention Grant
- Patent Title: Composite substrate, and method for the production of a composite substrate
- Patent Title (中): 复合基板,以及复合基板的制造方法
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Application No.: US12298723Application Date: 2007-04-20
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Publication No.: US08502264B2Publication Date: 2013-08-06
- Inventor: Volker Hârle , Uwe Strauss , Georg Brüderl , Christoph Eichler , Adrian Avramescu
- Applicant: Volker Hârle , Uwe Strauss , Georg Brüderl , Christoph Eichler , Adrian Avramescu
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cozen O'Connor
- Priority: DE102006019110 20060425
- International Application: PCT/DE2007/000725 WO 20070420
- International Announcement: WO2007/121735 WO 20071101
- Main IPC: H01L33/02
- IPC: H01L33/02

Abstract:
A composite substrate (1) comprising a substrate body (2) and a utility layer (31) fixed on the substrate body (2). A planarization layer (4) is arranged between the utility layer (31) and the substrate body (2). A method for producing a composite substrate (1) applies a planarization layer (4) on a provided utility substrate (3). The utility substrate (3) is fixed on a substrate body (2) for the composite substrate (1). The utility substrate (3) is subsequently separated, wherein a utility layer (31) of the utility substrate (3) remains for the composite substrate (1) on the substrate body (2).
Public/Granted literature
- US20090206348A1 Composite Substrate, and Method for the Production of a Composite Substrate Public/Granted day:2009-08-20
Information query
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