Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13053849Application Date: 2011-03-22
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Publication No.: US08502298B2Publication Date: 2013-08-06
- Inventor: Haruhiko Koyama
- Applicant: Haruhiko Koyama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-181625 20100816
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
In one embodiment, a semiconductor device includes a resistor element and a stacked-gate type memory cell transistor. The resistor element includes a first conductive layer which is formed on a second conductive layer via a first insulating layer, and is electrically connected to an interconnect, the second conductive layer being on a substrate and in a floating state. The stacked-gate type memory cell transistor is on the substrate, and includes a floating gate formed of the same material as the second conductive layer.
Public/Granted literature
- US20120037974A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-02-16
Information query
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