Invention Grant
US08502349B2 PN-junction varactor in a BiCMOS process and manufacturing method of the same
有权
PN结变容二极管在BiCMOS工艺及其制造方法相同
- Patent Title: PN-junction varactor in a BiCMOS process and manufacturing method of the same
- Patent Title (中): PN结变容二极管在BiCMOS工艺及其制造方法相同
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Application No.: US13315116Application Date: 2011-12-08
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Publication No.: US08502349B2Publication Date: 2013-08-06
- Inventor: Fan Chen , Xiongbin Chen
- Applicant: Fan Chen , Xiongbin Chen
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong Nec Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong Nec Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Blakely Sokoloff Taylor & Zafman
- Priority: CN201010585008 20101213
- Main IPC: H01L29/93
- IPC: H01L29/93

Abstract:
A PN-junction varactor in a BiCMOS process is disclosed which comprises an N-type region, a P-type region and N-type pseudo buried layers. Both of the N-type and P-type regions are formed in an active area and contact with each other, forming a PN-junction; the P-type region is situated on top of the N-type region. The N-type pseudo buried layers are formed at bottom of shallow trench field oxide regions on both sides of the active area and contact with the N-type region; deep hole contacts are formed on top of the N-type pseudo buried layers in the shallow trench field oxide regions to pick up the N-type region. A manufacturing method of PN-junction varactor in a BiCMOS process is also disclosed.
Public/Granted literature
- US20120146188A1 PN-JUNCTION VARACTOR IN A BICMOS PROCESS AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2012-06-14
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