Invention Grant
- Patent Title: Stacked layers of nitride semiconductor and method for manufacturing the same
- Patent Title (中): 堆叠氮化物半导体层及其制造方法
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Application No.: US13102204Application Date: 2011-05-06
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Publication No.: US08502350B2Publication Date: 2013-08-06
- Inventor: Hideto Sugawara , Masaaki Onomura
- Applicant: Hideto Sugawara , Masaaki Onomura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2010-284523 20101221
- Main IPC: H01L29/20
- IPC: H01L29/20

Abstract:
According to one embodiment, stacked layers of a nitride semiconductor include a substrate, a single crystal layer and a nitride semiconductor layer. The substrate does not include a nitride semiconductor and has a protrusion on a major surface. The single crystal layer is provided directly on the major surface of the substrate to cover the protrusion, and includes a crack therein. The nitride semiconductor layer is provided on the single crystal layer.
Public/Granted literature
- US20120153439A1 STACKED LAYERS OF NITRIDE SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-06-21
Information query
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