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US08502354B2 Break pattern of silicon wafer, silicon wafer, and silicon substrate 有权
硅晶片，硅晶片和硅基板的断裂图案

Break pattern of silicon wafer, silicon wafer, and silicon substrate
Abstract:
A break pattern of a silicon wafer includes a line to be cut which is set in the silicon wafer assuming a surface as a (110) face in a surface direction of a first (111) face perpendicular to the (110) face; and through holes which are provided in a plurality of rows on the line to be cut, wherein each of the through holes has a first (111) face, a second (111) face which intersects the first (111) face, and a third (111) face which intersects the second (111) face and the first (111) face, an intersecting point with end edges of the second (111) face and the third (111) face is assumed as a point closest to the adjacent through holes.
Abstract(Chinese):

硅晶片的断裂图案包括设置在硅晶片中的待切割线，其假设在垂直于（110）面的第一（111）面的表面方向上具有作为（110）面的表面; 和通孔，其设置在待切割线上的多列中，其中每个通孔具有第一（111）面，与第一（111）面相交的第二（111）面，以及第三 （111）面与第一（111）面交叉的第一（111）面，与第二（111）面和第三（111）面的端边缘的交点被假定为最靠近相邻通孔 孔。

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