Invention Grant
- Patent Title: Integrated circuit package system with extended corner leads
- Patent Title (中): 集成电路封装系统具有延长的角导线
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Application No.: US11965550Application Date: 2007-12-27
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Publication No.: US08502371B2Publication Date: 2013-08-06
- Inventor: Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Henry Descalzo Bathan
- Applicant: Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Henry Descalzo Bathan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00
Abstract:
An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.
Public/Granted literature
- US20090166845A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTENDED CORNER LEADS Public/Granted day:2009-07-02
Information query
IPC分类:
