An electronic device includes first and second electronic device dice. The first electronic device die is embedded within a resin layer. A dielectric layer is located over the device die and the resin layer. First interconnects within the dielectric layer connect a first subset of electrical contacts on the first electronic device to corresponding terminals at a surface of the dielectric that are located over the first electronic device. Second interconnects within the dielectric layer connect a second subset of electrical contacts on the first electronic device to corresponding bump pads at a surface of the dielectric that are located over the resin layer.