Invention Grant
- Patent Title: Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
- Patent Title (中): 垂直锥形传输线，用于高速多层球栅阵列封装中的最佳信号转换
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Application No.: US12713842Application Date: 2010-02-26
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Publication No.: US08502386B2Publication Date: 2013-08-06
- Inventor: Xiaohong Jiang , Hong Shi
- Applicant: Xiaohong Jiang , Hong Shi
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Broadly speaking, the embodiments of the present invention fill the need for methods of designing vertical transmission lines for optimal signal transition in multi-layer BGA packages. By controlling the impedance and geometry continuity of micro vias in each micro via layer in the package to follow smooth impedance and geometry curves from layer to layer, the return loss and insertion loss of the transmission line can be reduced or controlled to within acceptable ranges.
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