Invention Grant
US08502397B2 Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet
失效
用于半导体器件制造的耐热粘合片，用于片材的粘合剂，以及使用该片材制造半导体器件的方法
- Patent Title: Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet
- Patent Title (中): 用于半导体器件制造的耐热粘合片，用于片材的粘合剂，以及使用该片材制造半导体器件的方法
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Application No.: US12970282Application Date: 2010-12-16
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Publication No.: US08502397B2Publication Date: 2013-08-06
- Inventor: Yuichiro Yanagi , Kazuyuki Kiuchi , Shinji Hoshino
- Applicant: Yuichiro Yanagi , Kazuyuki Kiuchi , Shinji Hoshino
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-285570 20091216
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
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