Invention Grant
- Patent Title: Wiring board, semiconductor apparatus and method of manufacturing them
- Patent Title (中): 接线板，半导体装置及其制造方法
-
Application No.: US12244232Application Date: 2008-10-02
-
Publication No.: US08502398B2Publication Date: 2013-08-06
- Inventor: Kentaro Kaneko
- Applicant: Kentaro Kaneko
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2007-262753 20071005
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.
Public/Granted literature
- US20090095514A1 WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM Public/Granted day:2009-04-16
Information query
IPC分类:
