Invention Grant
- Patent Title: Methods and apparatuses to stiffen integrated circuit package
- Patent Title (中): 强化集成电路封装的方法和装置
-
Application No.: US13413616Application Date: 2012-03-06
-
Publication No.: US08502400B2Publication Date: 2013-08-06
- Inventor: Prasanna Karpur , Sriram Muthukumar
- Applicant: Prasanna Karpur , Sriram Muthukumar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/48
Abstract:
A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
Public/Granted literature
- US20120187583A1 METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE Public/Granted day:2012-07-26
Information query
IPC分类:
