Invention Grant
US08502612B2 Method and apparatus for determining within-die and across-die variation of analog circuits
有权
用于确定模拟电路的管芯内和模具间变化的方法和装置
- Patent Title: Method and apparatus for determining within-die and across-die variation of analog circuits
- Patent Title (中): 用于确定模拟电路的管芯内和模具间变化的方法和装置
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Application No.: US13197525Application Date: 2011-08-03
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Publication No.: US08502612B2Publication Date: 2013-08-06
- Inventor: Praveen Mosalikanti , Nasser A. Kurd , Timothy M. Wilson
- Applicant: Praveen Mosalikanti , Nasser A. Kurd , Timothy M. Wilson
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01R23/02
- IPC: G01R23/02 ; G01R27/00 ; H03K3/03

Abstract:
Described herein is the method and apparatus for determining frequency of an oscillator coupled with one or more analog devices, and for determining within-die or across-die variations in an analog property associated with the one or more analog devices, the determining based on the oscillator frequency. The analog property includes output signal swing, bandwidth, offset, gain, and delay line linearity and range. The one or more analog devices include input-output (I/O) buffer, analog amplifier, and delay line. The method further comprises updating a simulation model file based on the determining of the within-die and/or across-die variations of the analog property.
Public/Granted literature
- US20110285469A1 METHOD AND APPARATUS FOR DETERMINING WITHIN-DIE AND ACROSS-DIE VARIATION OF ANALOG CIRCUITS Public/Granted day:2011-11-24
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