Invention Grant
- Patent Title: Composite electronic module
- Patent Title (中): 复合电子模块
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Application No.: US13771306Application Date: 2013-02-20
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Publication No.: US08502616B2Publication Date: 2013-08-06
- Inventor: Takatoshi Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-206475 20100915
- Main IPC: H01P1/32
- IPC: H01P1/32

Abstract:
In a composite electronic module, electronic components including magnetic substances are mounted on a substrate such that lines of magnetic force generated by a permanent magnet of a non-reciprocal circuit element are concentrated to the non-reciprocal circuit element side. Therefore, even when a metal yoke is omitted, for example, it is possible to reduce the number of lines of magnetic force generated by the permanent magnet and which leak to the outside of the substrate, and hence to significantly reduce and prevent the influence of a magnetic field generated by the permanent magnet upon other electronic components that are arranged near or adjacent to the composite electronic module around the substrate.
Public/Granted literature
- US20130154757A1 COMPOSITE ELECTRONIC MODULE Public/Granted day:2013-06-20
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