Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13015889Application Date: 2011-01-28
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Publication No.: US08502617B2Publication Date: 2013-08-06
- Inventor: Ying-Tso Lai , Yung-Chieh Chen
- Applicant: Ying-Tso Lai , Yung-Chieh Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5.
Public/Granted literature
- US20120154075A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-06-21
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