Invention Grant
- Patent Title: Circuit module and measurement method
- Patent Title (中): 电路模块及测量方法
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Application No.: US13662589Application Date: 2012-10-29
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Publication No.: US08502619B2Publication Date: 2013-08-06
- Inventor: Hidemori Akagi
- Applicant: Murata Manufacturing Co., Ltd
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-106626 20100506
- Main IPC: H01P1/36
- IPC: H01P1/36

Abstract:
A circuit module and a measurement method enable accurate measurement of isolation characteristics of an isolator. The circuit module includes a processing circuit including SAW filters and a power amplifier and performs certain processing on an input signal. An isolator includes an input port, an output port and a ground port and outputs an input signal, which is input thereto via the input port and on which the processing circuit has performed the certain processing, as an output signal via the output port. A directional coupler distributes a signal transmitted between the processing circuit and the isolator. A measurement instrument inputs a test signal from the output port and measures a detection signal output from the directional coupler.
Public/Granted literature
- US20130049879A1 CIRCUIT MODULE AND MEASUREMENT METHOD Public/Granted day:2013-02-28
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