Invention Grant
- Patent Title: Circuit-substrate support structure and image-acquisition device
- Patent Title (中): 电路基板支撑结构和图像采集装置
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Application No.: US12644737Application Date: 2009-12-22
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Publication No.: US08502914B2Publication Date: 2013-08-06
- Inventor: Hideo Tanaami
- Applicant: Hideo Tanaami
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-016011 20090127
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
A circuit-substrate support structure includes a circuit substrate having electronic components mounted thereon, a first substrate-holding member provided at one side edge of the circuit substrate to hold the circuit substrate, a second substrate-holding member provided at the other side edge of the circuit substrate, opposite the one side edge, to hold the circuit substrate, and an elastic member provided together with the second substrate-holding member to hold the circuit substrate by applying elasticity in a surface direction of the circuit substrate.
Public/Granted literature
- US20100188565A1 CIRCUIT-SUBSTRATE SUPPORT STRUCTURE AND IMAGE-ACQUISITION DEVICE Public/Granted day:2010-07-29
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