Invention Grant
US08503140B2 Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures
有权
用于高压引脚ESD保护的双向背对背堆叠SCR,制造和设计结构的方法
- Patent Title: Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures
- Patent Title (中): 用于高压引脚ESD保护的双向背对背堆叠SCR,制造和设计结构的方法
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Application No.: US12898013Application Date: 2010-10-05
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Publication No.: US08503140B2Publication Date: 2013-08-06
- Inventor: Michel J. Abou-Khalil , Robert J. Gauthier, Jr. , Tom C. Lee , Junjun Li , Souvick Mitra , Christopher S. Putnam
- Applicant: Michel J. Abou-Khalil , Robert J. Gauthier, Jr. , Tom C. Lee , Junjun Li , Souvick Mitra , Christopher S. Putnam
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
Bi-directional back-to-back stacked SCRs for high-voltage pin ESD protection, methods of manufacture and design structures are provided. The device includes a symmetrical bi-directional back-to-back stacked silicon controlled rectifier (SCR). An anode of a first of the back-to-back stacked SCR is connected to an input. An anode of a second of the back-to-back stacked SCR is connected to ground. Cathodes of the first and second of the back-to-back stacked SCR are connected together. Each of the symmetrical bi-directional back-to-back SCRs include a pair of diodes directing current towards the cathodes which, upon application of a voltage, become reverse biased effectively and deactivating elements from one of the symmetrical bi-directional back-to-back SCRs while the diodes of another of the symmetrical bi-directional back-to-back SCRs direct current in the same direction as the reverse biased diodes.
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