Invention Grant
- Patent Title: Wafer support member, method for manufacturing the same and electrostatic chuck using the same
- Patent Title (中): 晶片支撑部件，制造方法及使用其的静电卡盘
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Application No.: US12919717Application Date: 2009-02-26
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Publication No.: US08503155B2Publication Date: 2013-08-06
- Inventor: Yasushi Migita
- Applicant: Yasushi Migita
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2008-045092 20080226; JP2008-079600 20080326
- International Application: PCT/JP2009/053505 WO 20090226
- International Announcement: WO2009/107701 WO 20090903
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B32B7/12
Abstract:
To provide a wafer support member that improves soaking properties of heating, the first wafer support member which comprises a base, an insulating material and a bonding layer that bonds the base and the insulating material, wherein the bonding layer has a stacked structure of a plurality of layers including a first layer and a second layer located closer to the insulating material than the first layer, and the first layer and the second layer have different thicknesses.
Public/Granted literature
- US20110058303A1 Wafer Support Member, Method for Manufacturing the Same and Electrostatic Chuck Using the Same Public/Granted day:2011-03-10
Information query
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