Invention Grant
- Patent Title: Mounting apparatus for expansion cards
- Patent Title (中): 扩充卡安装装置
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Application No.: US13249259Application Date: 2011-09-30
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Publication No.: US08503171B2Publication Date: 2013-08-06
- Inventor: Hai-Qing Zhou
- Applicant: Hai-Qing Zhou
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110252854 20110830
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A mounting apparatus for mounting expansion cards to expansion slots set on a circuit board includes a bracket and a number of mounting members. The bracket includes two racks opposite to each other and fixed to the circuit board. A number of spaced bars extend from the mounting piece. Each mounting member includes a fixing plate fixed to a corresponding bar, a locking portion extending from a top of the fixing portion. Two parallel raised portions protrude on an inner surface of the fixing plate to sandwich a corresponding end of the corresponding expansion card. The locking portion abuts against the top of the corresponding expansion card.
Public/Granted literature
- US20130050926A1 MOUNTING APPARATUS FOR EXPANSION CARDS Public/Granted day:2013-02-28
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