Invention Grant
- Patent Title: Shield cover, shield case, and circuit board module
- Patent Title (中): 屏蔽罩，屏蔽箱和电路板模块
-
Application No.: US12861186Application Date: 2010-08-23
-
Publication No.: US08503191B2Publication Date: 2013-08-06
- Inventor: Takayuki Nagata , Takahisa Ohtsuji
- Applicant: Takayuki Nagata , Takahisa Ohtsuji
- Applicant Address: JP Yao-Shi
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Yao-Shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-235899 20091013
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.
Public/Granted literature
- US20110085317A1 SHIELD COVER, SHIELD CASE, AND CIRCUIT BOARD MODULE Public/Granted day:2011-04-14
Information query
