Invention Grant
- Patent Title: Electronic device with adhesive-less fixed flat cable
- Patent Title (中): 电子设备，无粘接固定扁平电缆
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Application No.: US13076400Application Date: 2011-03-30
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Publication No.: US08503192B2Publication Date: 2013-08-06
- Inventor: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Rui Li
- Applicant: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Rui Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
An electronic device includes an EMI shielding board, two electronic components and a flat cable. The EMI shielding board includes a first side and a second side opposite to the first side. The two electronic components are arranged at the first side of the EMI shielding board. The flat cable is connected between the two electronic components. The EMI shielding board further includes a first through slot and a second through slot both configured therein. The flat cable passes through the EMI shielding board via the first and second through slots. A part of the flat cable is on the first side of the EMI shielding board, and the remaining part of the flat cable is on the second side of the EMI shielding board.
Public/Granted literature
- US20120206898A1 ELECTRONIC DEVICE WITH ADHESIVE-LESS FIXED FLAT CABLE Public/Granted day:2012-08-16
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