Invention Grant
- Patent Title: Stacked device remapping and repair
- Patent Title (中): 堆叠设备重新映射和修复
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Application No.: US13616704Application Date: 2012-09-14
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Publication No.: US08503258B2Publication Date: 2013-08-06
- Inventor: Brent Keeth , Chris G. Martin , Troy A. Manning , Joe M. Jeddeloh , Timothy B. Cowles , Jim Rehmeyer , Paul A. LaBerge
- Applicant: Brent Keeth , Chris G. Martin , Troy A. Manning , Joe M. Jeddeloh , Timothy B. Cowles , Jim Rehmeyer , Paul A. LaBerge
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C7/02
Abstract:
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die. Other embodiments are described.
Public/Granted literature
- US20130003473A1 STACKED DEVICE REMAPPING AND REPAIR Public/Granted day:2013-01-03
Information query
