Invention Grant
- Patent Title: Thermal management system
- Patent Title (中): 热管理系统
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Application No.: US13080549Application Date: 2011-04-05
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Publication No.: US08503494B2Publication Date: 2013-08-06
- Inventor: Dawson Yee
- Applicant: Dawson Yee
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Main IPC: H01S3/04
- IPC: H01S3/04

Abstract:
Various embodiments are disclosed for a thermal management system and related method for selectively thermally isolating and thermally connecting a target component. One embodiment of a system includes a first component having a first surface proximate to a target component, and an electromagnet between the first surface and the target component. A second component is spaced apart from the first component to form a gap that serves as a thermal boundary between the first component and the second component. A carrier fluid disposed within the gap includes multiple thermally conductive, ferrous particles. The carrier fluid is configured to align at least a portion of the thermally conductive, ferrous particles when the electromagnet generates a magnetic field that attracts the particles, and to displace at least a portion of the particles when the electromagnet generates a magnetic field that repels the particles.
Public/Granted literature
- US20120257646A1 THERMAL MANAGEMENT SYSTEM Public/Granted day:2012-10-11
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