Invention Grant
- Patent Title: Electret diaphragm and speaker using the same
- Patent Title (中): 驻极体隔膜和扬声器使用相同
-
Application No.: US12909842Application Date: 2010-10-22
-
Publication No.: US08503702B2Publication Date: 2013-08-06
- Inventor: Che-I Kao , Chih-Kung Lee , Wen-Ching Ko , Chang-Ho Liou , Ing-Yih Leu , Ming-Daw Chen , Yi-Jen Chan , Chien-Kai Tseng
- Applicant: Che-I Kao , Chih-Kung Lee , Wen-Ching Ko , Chang-Ho Liou , Ing-Yih Leu , Ming-Daw Chen , Yi-Jen Chan , Chien-Kai Tseng
- Applicant Address: TW Hsinchu TW Taipei
- Assignee: Industrial Technology Research Institute,National Taiwan University
- Current Assignee: Industrial Technology Research Institute,National Taiwan University
- Current Assignee Address: TW Hsinchu TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R7/00
Abstract:
An electret diaphragm and a speaker using the same are provided. The electret diaphragm includes an electret layer, a bonding layer adhered to a surface of the electret layer, and an aluminum (Al) electrode layer adhered on the bonding layer. The electret layer at least includes ethylene group polymer. A material of the bonding layer is ethylene-ethyl-acrylate (EEA) or ethylene-vinyl acetate (EVA).
Public/Granted literature
- US20110255720A1 ELECTRET DIAPHRAGM AND SPEAKER USING THE SAME Public/Granted day:2011-10-20
Information query
