Invention Grant
US08506055B2 MEMS integrated circuit having backside integrated circuit contacts
有权
具有背面集成电路触点的MEMS集成电路
- Patent Title: MEMS integrated circuit having backside integrated circuit contacts
- Patent Title (中): 具有背面集成电路触点的MEMS集成电路
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Application No.: US13197744Application Date: 2011-08-03
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Publication No.: US08506055B2Publication Date: 2013-08-13
- Inventor: Gregory John McAvoy , Rónán Pádraig Seán O'Reilly , David McLeod Johnstone , Kia Silverbrook
- Applicant: Gregory John McAvoy , Rónán Pádraig Seán O'Reilly , David McLeod Johnstone , Kia Silverbrook
- Applicant Address: IE Dublin
- Assignee: Zamtec Ltd
- Current Assignee: Zamtec Ltd
- Current Assignee Address: IE Dublin
- Agency: Cooley LLP
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.
Public/Granted literature
- US20110292120A1 MEMS INTEGRATED CIRCUIT HAVING BACKSIDE INTEGRATED CIRCUIT CONTACTS Public/Granted day:2011-12-01
Information query
IPC分类:
