Invention Grant
- Patent Title: Liquid droplet ejecting head and liquid droplet ejecting apparatus
- Patent Title (中): 液滴喷射头和液滴喷射装置
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Application No.: US12905470Application Date: 2010-10-15
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Publication No.: US08506057B2Publication Date: 2013-08-13
- Inventor: Eiju Hirai
- Applicant: Eiju Hirai
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-239335 20091016
- Main IPC: B41J2/045
- IPC: B41J2/045

Abstract:
A liquid droplet ejecting head including a pressure chamber substrate that is provided with a pressure chamber communicating with a nozzle orifice, an oscillating plate formed over the pressure chamber at a first area surface; a plurality of first conductive layers formed over the oscillating plate which completely overlap and extend beyond the first area surface; a piezoelectric layer formed over the first conductive layers so as to overlap at least over the first area surface; and a second conductive layer, which is continuously formed so as to cover the piezoelectric layer and completely overlap and extend beyond the first area surface at extending portions, which extend in at least a part of an area between the first conductive layers adjacent to each other.
Public/Granted literature
- US20110090291A1 LIQUID DROPLET EJECTING HEAD AND LIQUID DROPLET EJECTING APPARATUS Public/Granted day:2011-04-21
Information query
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