Invention Grant
- Patent Title: Seamless capsule manufacturing apparatus
- Patent Title (中): 无缝胶囊制造装置
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Application No.: US13124210Application Date: 2009-10-09
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Publication No.: US08506273B2Publication Date: 2013-08-13
- Inventor: Masayuki Ikeda , Hiroshi Nagao
- Applicant: Masayuki Ikeda , Hiroshi Nagao
- Applicant Address: JP Tokyo
- Assignee: Freund Corporation
- Current Assignee: Freund Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-269900 20081020
- International Application: PCT/JP2009/067614 WO 20091009
- International Announcement: WO2010/047236 WO 20100429
- Main IPC: B01J13/20
- IPC: B01J13/20 ; B01J2/06

Abstract:
A liquid coolant supply pipe and an over flow pipe are provided on the outer side of a capsule forming pipe through which a liquid coolant flows and into which liquid droplets are dropped from a nozzle. The liquid coolant is supplied to the liquid coolant supply pipe by a low pulsatory motion type pump, and the flow is regulated by a flow straightening block in the liquid coolant supply pipe. The cooling liquid passes through a liquid coolant introducing section having a curved surface, and then flows into the capsule forming pipe from an upper portion opening in a cap mounted to the upper part of the capsule forming pipe. The liquid coolant flows into the capsule forming pipe, and the excess flows into the overflow pipe.
Public/Granted literature
- US20110212203A1 SEAMLESS CAPSULE MANUFACTURING APPARATUS Public/Granted day:2011-09-01
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