Invention Grant
- Patent Title: Electrical connector with embedded shell layer
- Patent Title (中): 电连接器带嵌入式外壳层
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Application No.: US12959038Application Date: 2010-12-02
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Publication No.: US08506307B2Publication Date: 2013-08-13
- Inventor: David Henry , Jiachun Zhou , Kanapathipillai Prabakaran , Yingdong Ji
- Applicant: David Henry , Jiachun Zhou , Kanapathipillai Prabakaran , Yingdong Ji
- Applicant Address: US KS Kansas City
- Assignee: Interconnect Devices, Inc.
- Current Assignee: Interconnect Devices, Inc.
- Current Assignee Address: US KS Kansas City
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector and method of forming the same are provided, where the method can include affixing at least one layer to a core such that the layer is isomorphic to at least a portion of on an external surface of the core, press fitting the core with the layer into a socket cavity in a socket body, and removing the core from the socket cavity while leaving at least a portion of the layer so that the layer forms a shell layer affixed to an internal surface of the socket cavity. The method can further include inserting at least one plunger and a biasing device into a shell cavity so that a tail of the plunger is slidably received in the shell cavity and the biasing device biases a tip of the plunger away from an internal surface of the shell cavity.
Public/Granted literature
- US20120142229A1 Electrical Connector With Embedded Shell Layer Public/Granted day:2012-06-07
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