Invention Grant
- Patent Title: Polishing apparatus and polishing method
- Patent Title (中): 抛光设备和抛光方法
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Application No.: US12667891Application Date: 2008-07-08
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Publication No.: US08506362B2Publication Date: 2013-08-13
- Inventor: Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
- Applicant: Dai Fukushima , Atsushi Shigeta , Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Ebara Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Ebara Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-181617 20070711
- International Application: PCT/JP2008/062654 WO 20080708
- International Announcement: WO2009/008532 WO 20090115
- Main IPC: B24B7/26
- IPC: B24B7/26
Abstract:
A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.
Public/Granted literature
- US20110003537A1 POLISHING APPARATUS AND POLISHING METHOD Public/Granted day:2011-01-06
Information query
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