Invention Grant
- Patent Title: Substrate holder and substrate holding method
- Patent Title (中): 基板支架和基板保持方法
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Application No.: US12654561Application Date: 2009-12-23
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Publication No.: US08506363B2Publication Date: 2013-08-13
- Inventor: Tamami Takahashi , Hiroaki Kusa , Masaya Seki
- Applicant: Tamami Takahashi , Hiroaki Kusa , Masaya Seki
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-330053 20081225
- Main IPC: B24B29/02
- IPC: B24B29/02

Abstract:
A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.
Public/Granted literature
- US20100267317A1 Substrate holder and substrate holding method Public/Granted day:2010-10-21
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