Invention Grant
- Patent Title: Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
- Patent Title (中): 含钨基材的化学机械平面化的组合，方法和组成
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Application No.: US12630304Application Date: 2009-12-03
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Publication No.: US08506831B2Publication Date: 2013-08-13
- Inventor: Dianne Rachel McConnell , Ann Marie Hurst
- Applicant: Dianne Rachel McConnell , Ann Marie Hurst
- Applicant Address: US PA Allentown
- Assignee: Air Products and Chemicals, Inc.
- Current Assignee: Air Products and Chemicals, Inc.
- Current Assignee Address: US PA Allentown
- Agent Lina Yang
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C09K13/06
Abstract:
A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high.
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