Invention Grant
- Patent Title: Semielectroconductive polyimide resin belt and process for producing semielectroconductive polyimide resin belt
- Patent Title (中): 半导电聚酰亚胺树脂带和半导电聚酰亚胺树脂带的制造方法
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Application No.: US12734874Application Date: 2008-11-27
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Publication No.: US08506848B2Publication Date: 2013-08-13
- Inventor: Akira Ichino , Naoki Nishiura , Takashi Kuraoka
- Applicant: Akira Ichino , Naoki Nishiura , Takashi Kuraoka
- Applicant Address: JP Kyoto
- Assignee: Gunze Limited
- Current Assignee: Gunze Limited
- Current Assignee Address: JP Kyoto
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-310633 20071130
- International Application: PCT/JP2008/071580 WO 20081127
- International Announcement: WO2009/069715 WO 20090604
- Main IPC: H01B1/04
- IPC: H01B1/04 ; H01B1/24 ; G03G15/00

Abstract:
A semiconductive polyimide resin belt that exhibits excellent electrical properties, including the ability to achieve accurate image transfer in a color image-forming unit, and the ability to prevent variations in resistance due to the transfer voltage, enabling high-quality transfer images to be stably produced over an extended period of time; and excellent physical properties, including resistance to deterioration in flatness due to plastic deformation caused by loads applied in the width direction of the belt, excellent durability, and stable operation even after extended use; and an intermediate transfer belt made of the semiconductive polyimide resin belt. The semiconductive polyimide resin belt comprises carbon black and a polyimide resin. The polyimide resin is obtained by imidization of terphenyl-3,3′,4,4′-tetracarboxylic dianhydride and an aromatic diamine component containing 50 mol % or more of an aromatic diamine having 3 and/or 4 aromatic rings based on a total amount of the aromatic diamine component.
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