Invention Grant
US08506849B2 Additives and modifiers for solvent- and water-based metallic conductive inks
有权
用于溶剂和水基金属导电油墨的添加剂和改性剂
- Patent Title: Additives and modifiers for solvent- and water-based metallic conductive inks
- Patent Title (中): 用于溶剂和水基金属导电油墨的添加剂和改性剂
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Application No.: US12391817Application Date: 2009-02-24
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Publication No.: US08506849B2Publication Date: 2013-08-13
- Inventor: Xueping Li , Yunjun Li , Peter B. Laxton , David Max Roundhill , Hidetoshi Arimura
- Applicant: Xueping Li , Yunjun Li , Peter B. Laxton , David Max Roundhill , Hidetoshi Arimura
- Applicant Address: US TX Austin JP Hyogo
- Assignee: Applied Nanotech Holdings, Inc.,Ishihara Chemical Co., Ltd.
- Current Assignee: Applied Nanotech Holdings, Inc.,Ishihara Chemical Co., Ltd.
- Current Assignee Address: US TX Austin JP Hyogo
- Agency: Matheson Keys & Kordzik PLLC
- Agent Kelly Kordzik
- Main IPC: H01B1/02
- IPC: H01B1/02
Abstract:
A conductive ink includes metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants. The solvent may include water, an organic solvent, or any combination thereof. The conductive ink may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof.
Public/Granted literature
- US20090242854A1 ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS Public/Granted day:2009-10-01
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